Splash Financial Bags $70M Series C, Launches HELOC Offering

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Splash Financial, a student loan refinancing marketplace, has raised $70 million in a Series C led by Grand Oaks Capital, with participation from First Tech Federal Credit Union, Curql Collective, The OHIO Fund, and existing backers including CMFG Ventures, Citi Ventures, and Northwestern Mutual Future Ventures. Founded in 2013, the company has now raised over $135 million in equity funding and processed $6 billion in loans, expanding beyond student loan refinancing and personal loans to launch a new home equity line of credit (HELOC) offering of up to $500,000. The funding will be used to expand its credit union and bank network and strengthen its competitive lending platform as HELOC products gain market traction.

Splash Financial Bags $70M Series C, Launches HELOC Offering